Oku kulandelayo yinkqubo epheleleyo yokuvelisa ukusuka kwi-SMT (i-teknoloji ye-surface mount) ukuya kwi-DIP (i-double in-line package), kwi-AI yokubona kunye ne-ASSY (indibano), kunye nabasebenzi bezobugcisa ababonelela ngesikhokelo kuyo yonke inkqubo. Le nkqubo iquka amakhonkco angundoqo kwimveliso yombane ukuqinisekisa umgangatho ophezulu kunye nemveliso esebenzayo.
Gqibezela inkqubo yokwenziwa kweSMT→DIP→uhlolo lweAI→ASSY
1. SMT (iteknoloji yokunyuswa komphezulu)
I-SMT yinkqubo engundoqo yokwenziwa kombane, esetyenziswa ikakhulu ukufakela izixhobo zokuxhoma phezulu (SMD) kwi-PCB.
(1) Ushicilelo lwe-solder paste
Isixhobo: umshicileli we-solder paste.
Amanyathelo:
Lungisa i-PCB kwi-workbench yomshicileli.
Shicilela intlama ye-solder ngokuchanekileyo kwiiphedi ze-PCB ngokusebenzisa i-mesh yentsimbi.
Qwalasela umgangatho woshicilelo lwe-solder paste ukuqinisekisa ukuba akukho offset, ushicilelo olulahlekileyo okanye ushicilelo olugqithisileyo.
Amanqaku aphambili:
I-viscosity kunye nobukhulu be-solder paste kufuneka ihlangabezane neemfuno.
Umnatha wentsimbi kufuneka ucocwe rhoqo ukuze ugweme ukuvala.
(2) Ukubekwa kwecandelo
Izixhobo: Khetha kwaye ubeke umatshini.
Amanyathelo:
Layisha amacandelo e-SMD kwi-feeder yomatshini we-SMD.
Umatshini we-SMD uchola amacandelo ngombhobho kwaye uwabeke ngokuchanekileyo kwindawo echaziweyo yePCB ngokwenkqubo.
Jonga ukuchaneka kokubekwa ukuze uqiniseke ukuba akukho offset, iindawo ezingalunganga okanye iindawo ezingekhoyo.
Amanqaku aphambili:
I-polarity kunye nolwalathiso lwamacandelo kufuneka luchaneke.
Umbhobho womatshini we-SMD kufuneka ugcinwe rhoqo ukuze ugweme umonakalo kumacandelo.
(3) I-reflow soldering
Izixhobo: Iziko lokuntywila ngokutsha.
Amanyathelo:
Thumela iPCB enyusiweyo kwireflow soldering eziko.
Emva kwezigaba ezine zokufudumeza, ukushisa okuqhubekayo, ukuphindaphinda kunye nokupholisa, i-solder paste iyancibilika kwaye i-joint solder ethembekileyo yenziwe.
Jonga umgangatho we-soldering ukuqinisekisa ukuba akukho ziphene ezifana neendawo ezibandayo ze-solder, i-bridging okanye i-tombstones.
Amanqaku aphambili:
Ijika lobushushu le-reflow soldering kufuneka liphuculwe ngokweempawu ze-solder paste kunye namacandelo.
Ukulinganisa ubushushu beziko rhoqo ukuqinisekisa umgangatho ozinzileyo we-welding.
(4) Uhlolo lwe-AOI (uhlolo oluzenzekelayo lwamehlo)
Izixhobo: isixhobo sokuhlola esizenzekelayo (AOI).
Amanyathelo:
Optically scan i-PCB ethengisiweyo ukubona umgangatho wamalungu e-solder kunye nokuchaneka kwecandelo.
Rekhoda kwaye uhlalutye iziphene kunye nengxelo kwinkqubo yangaphambili yokulungiswa.
Amanqaku aphambili:
Inkqubo ye-AOI kufuneka iphuculwe ngokoyilo lwePCB.
Lungiselela izixhobo rhoqo ukuqinisekisa ukuchaneka kokufunyanwa.
2. Inkqubo ye-DIP (i-dual in-line package).
Inkqubo ye-DIP isetyenziswa ikakhulu ukufaka i- through-hole components (THT) kwaye idla ngokusetyenziswa ngokudityaniswa nenkqubo ye-SMT.
(1) Ufakelo
Izixhobo: umatshini wokufaka ngesandla okanye ozenzekelayo.
Amanyathelo:
Faka icandelo lokutyhubela umngxuma kwindawo echaziweyo yePCB.
Jonga ukuchaneka kunye nokuzinza kokufakwa kwecandelo.
Amanqaku aphambili:
Izikhonkwane zecandelo kufuneka zinqunywe ubude obufanelekileyo.
Qinisekisa ukuba i-polarity yecandelo ichanekile.
(2) Ukuthengiswa kwamaza
Izixhobo: isithando somlilo esinamaza.
Amanyathelo:
Beka i-plug-in PCB kwi-wave soldering oven.
Ukuthengisa izikhonkwane zecandelo kwiipadi zePCB ngokuthengiswa kwamaza.
Jonga umgangatho we-solder ukuqinisekisa ukuba akukho ndawo zibandayo zesolder, ibhulorho okanye iindawo ezivuzayo zesolder.
Amanqaku aphambili:
Ubushushu kunye nesantya sokuthengiswa kwamaza kufuneka kuphuculwe ngokweempawu zePCB kunye namacandelo.
Coca i-solder bath rhoqo ukuze uthintele ukungcola okuchaphazela umgangatho we-solder.
(3) I-soldering manual
Lungisa ngesandla iPCB emva kokutywinwa kwamaza ukulungisa iziphene (ezinje ngokubanda kwamalungu kunye nokubopha ibhulorho).
Sebenzisa intsimbi yokugoqa okanye umpu womoya oshushu kwi-solder yendawo.
3. Ubhaqo lwe-AI (ukubona ubukrelekrele bokwenziwa)
Ukufunyanwa kwe-AI kusetyenziselwa ukuphucula ukusebenza kakuhle kunye nokuchaneka kokuchongwa komgangatho.
(1) Ukubonwa okubonakalayo kwe-AI
Izixhobo: I-AI yokubona inkqubo yokubona.
Amanyathelo:
Thatha imifanekiso enenkcazo ephezulu yePCB.
Hlalutya umfanekiso ngokusebenzisa i-algorithms ye-AI ukuchonga iziphene ze-soldering, i-component offset kunye nezinye iingxaki.
Yenza ingxelo yovavanyo kwaye uyondle emva kwenkqubo yemveliso.
Amanqaku aphambili:
Imodeli ye-AI kufuneka iqeqeshwe kwaye iphuculwe ngokusekelwe kwidatha yemveliso yangempela.
Hlaziya i-algorithm ye-AI rhoqo ukuphucula ukuchaneka kokubona.
(2) Uvavanyo olusebenzayo
Izixhobo: Izixhobo zovavanyo oluzenzekelayo (ATE).
Amanyathelo:
Yenza iimvavanyo zokusebenza zombane kwi-PCB ukuqinisekisa imisebenzi eqhelekileyo.
Rekhoda iziphumo zovavanyo kwaye uhlalutye izizathu zeemveliso ezineziphene.
Amanqaku aphambili:
Inkqubo yovavanyo kufuneka iyilwe ngokweempawu zemveliso.
Lungiselela rhoqo izixhobo zovavanyo ukuqinisekisa ukuchaneka kovavanyo.
4. Inkqubo ye-ASSY
I-ASSY yinkqubo yokudibanisa i-PCB kunye namanye amacandelo kwimveliso epheleleyo.
(1) Indibano yoomatshini
Amanyathelo:
Faka iPCB kwindlu okanye isibiyeli.
Qhagamshela amanye amacandelo afana neentambo, amaqhosha, kunye nezikrini zokubonisa.
Amanqaku aphambili:
Qinisekisa ukuchaneka kwendibano ukunqanda umonakalo kwi-PCB okanye amanye amalungu.
Sebenzisa izixhobo ezichasene ne-static ukukhusela umonakalo omileyo.
(2) Ukutshiswa kwesoftware
Amanyathelo:
Tshisa i-firmware okanye isoftwe kwinkumbulo yePCB.
Jonga iziphumo ezivuthayo ukuze uqinisekise ukuba isoftware isebenza ngokuqhelekileyo.
Amanqaku aphambili:
Inkqubo evuthayo kufuneka ihambelane nenguqulo ye-hardware.
Qinisekisa ukuba indawo etshisayo izinzile ukuphepha ukuphazamiseka.
(3) Uvavanyo lomatshini wonke
Amanyathelo:
Yenza iimvavanyo ezisebenzayo kwiimveliso ezidibeneyo.
Jonga imbonakalo, ukusebenza kunye nokuthembeka.
Amanqaku aphambili:
Izinto zovavanyo mazibandakanye yonke imisebenzi.
Ukurekhoda idatha yovavanyo kwaye uvelise iingxelo ezisemgangathweni.
(4) Ukupakishwa kunye nokuthunyelwa
Amanyathelo:
Ukupakishwa kwe-Anti-static yeemveliso ezifanelekileyo.
Ileyibhile, pakisha kwaye ulungiselele ukuthunyelwa.
Amanqaku aphambili:
Ukupakishwa kufuneka kuhlangabezane neemfuno zokuhamba kunye nokugcinwa.
Rekhoda ulwazi lokuthumela ngenqanawa ukuze kube lula ukulandela umkhondo.
5. Amanqaku aphambili
Ulawulo lokusingqongileyo:
Thintela umbane ongatshintshiyo kwaye usebenzise izixhobo ezichasene ne-static kunye nezixhobo.
Ukugcinwa kwezixhobo:
Rhoqo gcina kwaye ulungelelanise izixhobo ezinje ngabashicileli, oomatshini bokubeka, ii-oveni zokuqukumbela, ii-oveni ezithengiswayo zamaza, njl.
Uphuculo lwenkqubo:
Lungiselela iiparamitha zenkqubo ngokweemeko zokwenyani zemveliso.
Ulawulo lwemeko:
Inkqubo nganye kufuneka ihlole umgangatho ongqongqo ukuqinisekisa isivuno.
